AEC-Q102与AEC-Q101有什么区别?

适用对象

对象：车用分立半导体元器件
  晶体管:BJT、MOSFET、IGBT
  二极管：Diodes、Rectifier、Zeners、PIN、Varactors
  光器件：LEDs、Optocoupler、Photodiodes、Phototransistors
     

对象：车用分立光电半导体元器件       
  Light Emitting Diodes、Laser Components、Photodiodes、Phototransistors
     

样本量

环境应力试验：3lot×77pcs/lot
  LTPD(Lot Tolerance Percent Defective) = 1, 90%置信度的失效率为1%
     

环境应力试验：3lot×26pcs/lot
  LTPD (Lot Tolerance Percent Defective) = 3, 90%置信度的失效率为3%

失效判据

不符合规格书规定的电学和光学参数范围
  环境试验前后参数值变化未保持在±20%以内；漏电未保持在5倍初始值以内（对于湿气试验为10倍）
  由于环境试验出现物理损坏
  如果失效原因被供应商和用户认为是由于处理不当或ESD的原因引起，这些失效可以被忽略，但应呈现在报告中
     

不符合规格书规定的电学和光学参数范围
  环境试验前后参数值变化未保持在附录5规定的±x%以内
  由于环境试验出现物理损坏（迁移、腐蚀、机械破坏、分层等）；有些物理损坏可能由供应商和用户同意认为仅仅是外观不良而不影响认证结果；
  如果失效原因被供应商和用户认为是由于处理不当、测试板连接、ESD或其它跟测试条件无关的原因引起，这些失效可以被忽略，但应呈现在报告中

应力前后参数测试

高温工作

施加最大偏置

5a HTOL1：最高允许工作温度条件下施加一定的驱动电流使得结温达到最高允许值
  5b HTOL2：为最大驱动电流条件下选择工作温度使得结温达到最高允许值
  无需降额时，5a=5b

温度循环

低温-55℃，高温为最高结温（不超过150℃）

低温-40℃，高温根据焊点温度调整

高温高湿

Ta=85℃/85%RH，器件施加额定正向偏置

6a WHTOL1：双85条件下施加一定的驱动电流使得结温达到最高允许值，30min开/30min关
  6b WHTOL2：双85条件下施加最小驱动电流、如无最小电流则施加不使结温超3K的驱动电流

功率温度循环

温升≥100℃

低温-40℃，高温根据焊点温度来定

DPA

从完成H3TRB或HAST、TC试验的样品中，每项随机抽取2个样品

完成功率温度循环（PTC）/间歇工作寿命（IOL）、高温高湿工作（WHTOL1、WHTOL2）/高温高湿反偏（H3TRB）、硫化氢腐蚀（H₂S）、混合气体腐蚀（FMG）试验的样品中随机抽取2只/批

热阻

JESD24-3（MOS），JESD24-4（BJT），JESD24-6（IGBT）

JESD51-50、JESD51-51、JESD51-52，针对LED

7

温度循环Temperature Cycling

TC

1

DGU

77

3 Note B

0

JESD22 A-104 Appendix 6

1000 cycles(T_A=minimum range of -55℃ to maximum rated junction  temperature,not to exceed 150℃).Can reduce duration to 400 cycles using T_A(max)=25℃ over part maximum rated junction    temperature or   using T_A(max)=175℃ if the maximum rated   junction temperature is above 150℃.TEST before and   after TC

9a

高温高湿High Temperature High Humidity Bias

HTHHB

1

DGUZ

77

3 Note B

0

JESD22 A-101

1000 hours at T_A=85℃/85%RH with part   Forward    biased.TEST before and after H3TRB as a minimum

10
        alt

功率温度循环Power and Temperature Cycle

PTC

1

DGTUW

77

3 Note B

0

JESD22 A-105

Perform PTC if △T_J≥100℃ can    not be achieved with   IOL. Tested per duration indicated for timing    Requirements in   Table 2A.Parts Powered and Chamber cycled to insure    △T_J≥100℃(not   to exceed absolute maximum ratings).
  TEST before and after PTC as a minimum.

12

DPA Destructive Physical Analysis

DPA

1

DG

2

1 Note B

0

AEC-Q101-004 Section 4

Random sample of parts that have    successfully completed   H3TRB or HAST, and TC.

22

热阻Thermal Resistance

TR

3

DG

10 each,pre-&post-change

1

0

JESD24-3,24-4,24-6 as appropriate

Measure TR to assure    specification compliance and provide   process change comparison data.

5b

高温工作High Temperature Operating Life HTOL

HTOL2

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A108

Only for LED and Laser    Component
  Duration 1000 h at maximum Specified drive current,Choose corresponding      T_solder according to derating curve to achieve max Tj   defined in the part    specification.Test 5b is equivalent to 5a if   no derating.For use within    specical application; a longer test   duration my be needed to ensure    reliability over aplication   lifetime.For details,see Appendix    7a"Reliability Validation   for LEDs"
  Test before and after HTOL2

7

温度循环Temperature Cycling

TC

D,G

26

3 Note B

0

JEDEC JESD22-A104

PC before TC
  Duration 1000 cycles.Minimum soak & dwell time 15 min.Minimum      temperature as specified in part specification. Choose TC condition   exceeding    or equal to the operating temperature according to the   apporopriate part    specification:
  TC condition 1:max T_solder=85℃
  TC condition 2:max T_solder=100℃
  TC condition 3:max T_solder=110℃
  TC condition 4:max T_solder=125℃
  TC condition and tranfer time shall be mentioned    in the test   report.
  It is recommended to  decapsulate the    part after TC and   perform WBP if applicable.Report data.The supplier has to      provide explanation in case that WBP cannot be performed.
  TEST before and after TC.

6a

高温高湿Wet High Temperature Operating Life

WHTOL1

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A101

Only for LED and Laser    Component
  PC before WHTOL1
  Duration 1000 h at T_solder=85℃/85%RH      with drive current according to derating curve to    achieve   max Tj defined in the part specification.Operated with power cycle 30 min on   /30 min off
  Test before and after WHTOL1,DPA after WHTOL1

6b

高温高湿Wet High Temperature Operating Life

HTOL2

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A101

Only for LED and Laser    Component
  PC before WHTOL2
  Duration 1000 h at T_solder=85℃/85%RH with   minimum drive current according    to part specification.If no   minimum rated drive  current is specified, a drive current shall      be chosen not  to exceed a rise of 3K    for T_junction.
  Test before and after WHTOL2,DPA after WHTOL2

8a

功率温度循环Power Temperature Cycling

PTC

D,G,X,Y

26

3 Note B

0

JEDEC JESD22-A105

Only for LED and Laser    Component
  PC before PTC
  Duration 1000 temperature cycles with drive current according to   derating    curve to achieve max Tj specified in part   specification.
  Operated with power cycle 5 min on/ 5 min off.
  Minimum temperature as specified in part specification. For maximum      temperature choose:
  PTC condition 1:max T_solder=85℃
  PTC condition 2:max T_solder=105℃
  PTC condition 3:max T_solder=125℃
  PTC condition should be chosen closest to the    operating temperature   range within the appropriate part specification. PTC    condtion   shall be mentioned in the test report. For use within special      application; a longer test duration may be needed to ensure reliability      over  application liftime.For    details.see Appendix   7a "Reliability Validation for LEDs"
  TEST before and after PTC.DPA after PTC.

11

DPA Destructive Physical Analysis

DPA

D,G

2(for each test)

1 Note B

0

Appendix 6

Random sample of parts that have    successfully completed   PTC/IOL.WHTOL/H3TRB,H₂S,and FMG(2 samples each)

24

热阻Thermal Resistance

TR

D,G,X,Y

10 each,pre-&post-change

1

0

JEDEC
    JESD51-50
    JESD51-51
    JESD51-52

Measure thermal resistance    according to JESD51-50,   JESD51-51,and     JESD51-52 to assure specification   compliance.